Background

Pain and related emotions are difficult to measure in patients with restricted communicative abilities and even in people that can communicate their sensations it is unfeasible to continuously ask them to report those sensations in order to personalize their therapy. This workshop aims to bring together researchers working in the area of recognition, treatment and management of pain and related emotional states.
The workshop is comprised of two parts. The first part invites research submissions covering various topics related to technology for pain management. The second part invites researchers to participate in the EmoPain challenge to foster research in the automatic recognition of pain-related multimodal behaviour in people suffering from chronic pain. The workshop will feature two invited speakers and will end the proceedings with an interdisciplinary panel to complement the presentations and further contribute to set a route map for designing effective technology for the management of pain and related states.



Workshop Focus

We invite submissions of research papers that consider to this topic and address the following aspects (but not limited to):

  • Design of benchmark datasets of clinical and chronic pain
  • Design of benchmark datasets of not pain associated distress (e.g. itching, confusion, panic, delirium)
  • Analysis of multimodal cues and patterns related to distress• Technologies for monitoring and assessing the severity of distress
  • Automated diagnostic methods for pain and distress states
  • Personalized coaching and companion technologies for distress management
  • Assistive technologies for distress rehabilitation
  • Cyber therapy and telemedicine for patients suffering from distress
  • Studies investigating the interdependencies between pain and not pain associative affective states

EmoPain Challenge 2019

The EmoPain challenge aims to foster research in the area of pain and related emotion recognition using the EmoPain dataset. More information on the challenge and how to participate are at :

EmoPain Challenge 2019

Paper Submission

Papers should be submitted through EasyChair. Papers should be up to 7 pages (6 pages + 1 page for references) in
ACII paper format . The reviewing process will be double-blind.

A link to the paper submissions page will follow shortly.



Important Dates


Challenge

Training and Validation Data Available: 14th of June, 2019

Testing Data Available: 19th of June, 2019

Results Uploading Deadline: 24th of June, 2019


Workshop and Challenge Papers

Paper Submission Deadline: 25th of June 2019

Notification: 8th of July 2019

Camera Ready due: 12th of July, 2019

Workshop Date: 3rd of September, 2019

Workshop Organizers


Steffen Walter

University of Ulm

Nadia Berthouze

University College London

Amanda Williams

University College London

Daniel Lopez-Martinez

Massachusetts Institute of Technology

Hongying Meng

Brunel University London

Hane Aung

University of East Anglia

Michel Valstar

University of Nottingham

Nic Lane

University of Oxford

Rosalind W. Picard

Massachusetts Institute of Technology



EmoPain Challenge Data Chair


Chongyang Wang

University College London

Temitayo Olugbade

University College London

Joy Egede

University of Nottingham




Program Commitee

Zakia Hammal, Carnegie Mellon University, USA
Raimondo, Schettini, University of Milan, Italy
Abhinav Dhall, Indian Institute of Technology, India
Giacomo Turri, Instituto Italiano di Tecnologia, Italy
Tong Chen, Southwest University, China
Raimondo, Schettini, University of Milan, Italy
Moi Hoon Yap, Manchester Metropolitan University, UK
Maurizio Mancini, University College Cork, Ireland
Huibin Li, Xi’an Jiaotong University, China
Paolo Napoletano, University of Milano, Italy
Massimiliano Pontil, Istituto Italiano di Tecnologia, Italy
Radek Niewiadomski, University of Genoa, Italy
Luca Romeo, Universita delle Marche, Italy
Gualtiero Volpe, University of Genoa, Italy
Bernardino Romera Paredes, Google DeepMind, UK




Agenda: Workshop Program

Stay tuned, details to follow soon!



Keynote Speakers to appear soon